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SMT Precision Laser

LaserTec’s expert Stencil Design team coupled with our unique precision stencil manufacturing techniques plays a key role in ensuring an optimum Stencil Printing Process . Control of the aperture characteristics, stencil thickness and accurate fiducial generation are directly related to the volume, alignment and positioning of paste deposited during printing. Correct stencil design, coupled with quality manufacture, makes a significant contribution to end of line yield.
LaserTec offer unrivalled turnaround times of 2 days as standard with the option of faster turnaround (4 hours) where required and no compromise in the accuracy and quality of the stencil . All LaserTec stencils are designed and produced to the highest standards. Our professional and skilled team are committed to working closely with our customers in order to develop optimum stencil/process specifications and advice is readily provided on all aspects of the screen printing process .
The cross section of a 16 mil pitch aperture cut by Laser illustrates the consistent cut quality and straight trapezoidal side walls which encourage optimum paste release. Guaranteed tolerance of aperture dimensions to ±5µm over the entire printable area of the stencil makes for consistent and accurate replication of board features, even with very large backplanes
Stencils are generated from stainless steel, carefully selected for flatness and uniform thickness – important qualities in a precision stencil.
LaserTec’s expertise also lies at the heart of our precision stencil cutting equipment, featuring pumped Nd-YAG lasers. Our close involvement with the laser manufacturer ensures the highest levels of accuracy, repeatability and throughput; the foundation of a truly world class stencil service. LaserTec ensures 100% inspection of every stencil produced using a high precision scanner as part of our final QA inspection.

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Stencil Ordering Checklist

Frame / Foil Type:
Please specify the machine type and frame / foil size, or use our frame and foil codes (see “Customer frame codes.doc”).
If you wish to return frames to be re-used, please ensure they are clearly marked with your company name. Frames should be returned at least one week prior to ordering stencils. If we do not receive your frames in time for them to be refurbished we will supply your order with new frames and hold your returned frames in sock for future orders.
Squeegee Side:
It is very important that the correct view side of your data is clearly marked. If your data contains tracking and silkscreen layers we can normally determine the correct view, however if this data is unavailable please ensure you supply a plot of the image marked to indicate the squeegee side.
Fiducial Marks:
If you require fiducial marks please ensure these are present on your data, and indicate on the order form which side of the stencil they should be ½ etched onto. If the fiducial contained in the data are not of the correct size and shape please specify the required changes.
Aperture Modifications:
Please supply full details of any aperture modifications required. If you would prefer us to recommend modifications please indicate this on your order, and we will contact you to confirm suitable modifications.Please also highlight any items on the paste data that are not required as apertures on the stencil If no modifications are specified we will manufacture the stencil at data size.
Image Position:
Please indicate if you require the image to be placed centrally within the stencil, or if an offset position is required.
For offset images please supply a drawing showing the required offsets and the front edge of the image (note that it is essential that your data contains the full PCB / panel outline).
Data:
The paste data should ideally be supplied in extended gerber format (RS 274X), if possible please include layers for the copper tracking, silkscreen and PCB outline.
If your PCB is panellised or step and repeated please ensure that the data contains this information.
All files should be zipped together and attached to an e-mail giving full contact details (If your data is to be supplied by a third party please ensure they indicate that the data is being sent on your behalf).
To ensure rapid processing of your order please send both the order form and data together attached to one e-mail.

Technical

Typical Stencil Aperture Design Guidelines

For a more detailed analyis of your requirement please contact LaserTec directly .

• We recommend to use 127micron foil stencil where there are 0.5mm pitch components on the stencil / board. Again please contact LaserTec for more information

• Al Stainless steel thickness are available from 100um to 250um .

• Ultra Fine Pitch grade (UFP) stainless steel (has a grain size of 1-2 um and it is high Ni contain) is also available – a substitute to Electroform stencils

• All frame sizes available

Documentation
Documentation

Documentation

SUB SUB FOIL ONLY
SUB SUB-Step Stencil I
SUB SUB-Precision Laser and UFP II

UFP

Heart Sine ImageLasertec UFP saves you time and money, and delivers significant benefits in comparison with 300 series stainless steel stencil.
Flatter Stencils – allows for more accurate printing of finer apertures
Harder Surface – provides a more durable stencil increasing cycle time between stencil changes
More Uniform Surface Aspect – allows for higher stress relaxation properties so stencils that are laser cut or etched will have more consistent results.

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UFP is a fine grain stainless steel with superior fatigue strength, exceptionally smooth surface and elevated wear factor.

Smaller grain size – Standard stainless steel has a grain size of 20 to 30 microns. UFP has a grain size of 1 to 2 microns. This super fine crystal grain is achieved by reducing carbon which moderates recrystallization behavior and prevents the formation of Cr23C6 (chrome-carbide — seen as smut and rust on the surface — which prevents formation of a passivation layer); adding nitrogen which gives solid solution strengthening; and the addition of niobium which yields fine grain size and provides secondary protection against the formation of Cr23C6.

Better energy absorbtion – The proprietary recrystallization moderating procedure results in the huge increase in the number of grains in the substrate, and thus the number of grain boundaries. Since energy is absorbed at the grain boundary, the increase in grain boundaries yields higher energy absorption. This also provides a material with a hardness greater than 430 HV and has a cycle life of 107 cycles before failure in mechanical applications such as springs or gaskets.

Uniform Grain Structure – yields smoother aperture walls, and will yield better results from zero cutting when step etching. UFP yields improved paste roll, aperture wall texture, and paste release, while maintaining the same thermal and mechanical properties as traditional stainless steel.

Greater adhesion to resist – better paste release – The pictures below show that the finer grain of UFP does not have the rolling direction bias seen in traditional stainless steels offering greater adhesion for the resist and less inclusions for the solder paste to get trapped in which leads to smearing and residue. In addition, because of its finer grain, UFP does not require Electro-polishing to remove burrs and surface blemishes.

Larger contact area – The smaller grain of UFP provides a mechanically smoother surface with larger contact areas for resist, or cleaner surface for the paste to roll over.

Incease in print resolution – Fine grain structure of UFP Stainless Steel yields faster etch rates, cleaner etching and an increase in print resolution: more consistent paste heights are achieved with UFP Stainless Steel Stencil.

Technical

Benefits of LaserTec Stencils

– Stencil thickness: 50 µm – 500 µm.
– High Precision +-5um across full printable image
– Aperture Width control +-8um
– Optimum Stencil design guidelines
– 100% quality check
– standard 2 day turnaround (2-4 hr turnaround if required)
– Trapezoidal aperture shape for optimum paste release
– LaserTec uses a high resolution scanner to generate the gerber from bare PCB or Film where design data is unavailable
– Cut from finest quality stainless steel for uniformity and accuracy
– ISO9002 certified
– LaserTec stencils are 100% stencil wash compatible, have etched foil perforations on all stencils and all our stencils incorporate a compatible screen blocker
– LaserTec has the capability to receive your data in many different formats.

Documentation
Documentation

Documentation

Foil Tensioning

Heart Sine ImageLaserTec offers an alternative Stencil Foil System which is compatible with known foil tensioning systems such as Tetra and Vector Guard. It is more durable foil (Less Prone to damage) and has more Consistent Tension across the entire foil. Other benefits of this system is that it is Easy to store and handle, has a variety of Colour Formats and is also Laser Markable
Note also the Corner Inserts for increased rigidity.

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Technical

TENSIONING TECHNICAL

Documentation
Documentation

Documentation

SMT Step Stencil

Heart Sine ImageOur step stencil can be processed through a carefully managed chemical etch procedure before laser cut or through a milling procedure. The etch is measured frequently in the process to ensure the etch cutting depth is correct. Our stencils have very controlled etch process. We offer a depth control of 5 micron accuracy.
each stencil has smooth etch surface for good paste release along with contoured etch wall profile to extend squeegee life.

Technical
Typical Stencil Aperture Design Guidelines

For a more detailed analyis of your requirement please contact LaserTec directly .

Documentation
Documentation

Documentation

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