SMT Print tooling

BGA Reballing Fixtures

This method involves component-specific stencils and tooling to allow paste or flux to be printed and loose solder balls to be located in the correct position before being reflowed – again in a controlled environment. Solder balls of different sizes and compositions are available from us or your solder paste manufacturer.
The diagrams show the process being used with printed solder paste and non-melt, high-temperature solder balls.
Stencil printing. Figure 1 shows solder flux gel being printed onto the component. The part is held in a fixture and the solder paste is manually applied using a LaserTec mini stencil.
Solder ball application. In the second stage (Figure 2), the flux gel printing stencil has been removed and replaced with a larger stencil that will dictate the position of each solder ball. Loose solder balls are then poured onto this stencil and fall ( or brushed ) into their intended positions above each printed pad. When all the apertures have been filled, any excess solder balls can be brushed off or poured off the stencil.
Reflow. After all of the balls have been placed, the component is ready for reflow. The method shown in Figure 3 completely removes the stencil and uses forced convection from above to reflow the solder balls.
The reballed part is removed from the fixture and is ready to be attached to the PCB as a normal component.
This method is preferred over the solder paste rebumping method as the size and shape of the balls can be controlled

All of these technologies and process guides are avilable from any of our staff just give us a call